App note: Ball grid array explained
Here is Texas Instrument’s application note on Ball Grid Array IC packages. It provides general information about BGAs, and the many versions of the same.
Leaders in the consumer electronics industry will be determined by their ability to deliver increasingly miniaturized products at lower costs. The Ball Grid Array (BGA) package achieves these objectives by providing increased functionality for the same package size while being compatible with existing Surface Mount Technology (SMT) infrastructure.
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