App note: Ball grid array explained

in app notes by DP | 3 comments

Here is Texas Instrument’s application note on Ball Grid Array IC packages. It provides general information about BGAs, and the many versions of the same.

Leaders in the consumer electronics industry will be determined by their ability to deliver increasingly miniaturized products at lower costs. The Ball Grid Array (BGA) package achieves these objectives by providing increased functionality for the same package size while being compatible with existing Surface Mount Technology (SMT) infrastructure.

 

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Comments

  1. Alan says:

    Holy Buddha, that’s a lotta pins. I suppose the only thing left is to put pins on TOP, too.

    The chip would get “sandwiched” between 2 PC Boards. An extension of the technique used by ADC and DAC to isolate Analog from Digital.

    But – I pity the person who needs to DE-solder something like that.

  2. Fractal says:

    I remember learning all about these- to fix a g92 series nvidia graphics card.
    They used two types of solder for the board, and the ball array. It didn’t really work out too well after ~500 thermal cycles.
    Ultimately, a gentle bake (200 degrees C) did not fix it, though a longer 220 degree bake has had it fixed for a week. Possibly pressing the chip down with rod may have helped?
    Overall, fiddly creations!

  3. Drone says:

    Hey those Geode parts are IA-X86 compatible SoC’s, aren’t they? I thought TI sold that line to AMD ages ago. Nice parts though. I think they use them in the little Alix PC’s.

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