App note: One serial EEPROM footprint to rule them all
Microchip describes how to make CAD footprints that fit several different sizes of serial EEPROM data storage chips. This gives your project flexibility in case the larger footprints can no longer be sourced:
This entry was posted in app notes and tagged app note, microchip, PCB design.For many years, the 8-lead SOIC package has been the most popular package for serial EEPROMs, but now smaller packages are becoming more and more commonplace. This offers a number of benefies; the reductions in footprint size and component height are some of the obvious ones. Smaller packages also generally offer a cost advantage over their larger counterparts.
Comments
What’s with the rounded pads for the soic/tssop/msop parts? Has anyone seen rounded smd pads before like that? Useful/useless for hand soldering?
I don’t think the rounded pads make too much difference in hand soldering, or they might actually improve it with the surface tension holding the blob better in the rounded pad.
The way to go of course is hot air and solder paste, available very cheaply nowadays.