App note: Guidelines for soldering QFN lead-less packages
This app note from Texas Instruments covers the basic guidelines on how to solder QFN and SON lead-less package. It includes some PCB design, solder paste screen printing, assembly, and reflow guidelines.
Quad flatpack no leads (QFNs) and small-outline no leads (SONs) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface of the connecting substrate (PCB, ceramic). This application report presents users with introductory information about attaching QFN/SON devices to printed circuit boards (PCBs).
Via the forum.This entry was posted in app notes and tagged app note, pcb, QFN/SON, soldering.